Overview

This book provides the background, tools, and directions you need to confidently choose fabrication methods and materials for miniaturization problems (materials, processes, designs, characterisations and potential applications).MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. The development of micro-mechanical systems (MEMS) foreshadows momentous changes not only in the technology world, but in virtually every aspect of human life.

Full Product Details

Author:   Francis E. H. Tay
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2002
Volume:   9
Dimensions:   Width: 15.50cm , Height: 1.70cm , Length: 23.50cm
Weight:   0.504kg
ISBN:  

9781441953032

ISBN 10:   1441953035
Pages:   299
Publication Date:   03 December 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock  
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

1. Integration of Piezoelectric Pb (ZrxTi1?x)03 (PZT) Thin Films into Micromachined Sensors and Actuators.- 2. Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding.- 3. GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs.- 4. Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications.- 5. Chemically Amplified Resist for Micromachining using X-Ray Lithography.- 6. Self-Assembled Monolayers (SAM) for Tunneling Sensors.- 7. Oxidation Process-Optimization for Large Area Silicon Fusion Bonded Devices and MEMS Structures.- 8. Silicon Nanomachining by Scanning Probe Lithography and Anisotropie Wet Etching.- 9. A Novel Bulk Micromachining Method in Gallium Arsenide.- 10. Deep X-Ray Lithography for MEMS-Photoelectron Exposure of the Upper and Bottom Resist Layers.- 11. Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnect.- 12. Uncooled Infrared Image Sensor of Dielectric Bolometer Mode using Ferroelectric BST Thin Film Prepared by Metal Organic Decomposition.- 13. Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process.- 14. Plasma Etching Techniques to Form High-Aspect-Ratio MEMS Structures.

Reviews

Author Information

Tab Content 6

Author Website:  

Countries Available

All regions