Materials for Electronic Packaging
Author:   Deborah D.L. Chung (Composite Materials Research Laboratory, University at Buffalo, State University of New York.)
Publisher:   Elsevier Science & Technology
ISBN:  

9780750693141


Pages:   368
Publication Date:   31 March 1995
Format:   Hardback
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

Our Price $712.80 Quantity:  
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Materials for Electronic Packaging


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Author:   Deborah D.L. Chung (Composite Materials Research Laboratory, University at Buffalo, State University of New York.)
Publisher:   Elsevier Science & Technology
Imprint:   Butterworth-Heinemann Ltd
Dimensions:   Width: 16.10cm , Height: 2.20cm , Length: 24.10cm
Weight:   0.730kg
ISBN:  

9780750693141


ISBN 10:   0750693142
Pages:   368
Publication Date:   31 March 1995
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

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