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OverviewSignificant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging. Full Product DetailsAuthor: Daniel Lu , C P Wong (Georgia Institute of Technology)Publisher: Springer Us Imprint: Springer Us ISBN: 9781281954268ISBN 10: 1281954268 Pages: 719 Publication Date: 01 January 2009 Audience: General/trade , General Format: Undefined Publisher's Status: Active Availability: Available To Order We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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