|
![]() |
|||
|
||||
OverviewFull Product DetailsAuthor: David Wolpert , Paul AmpaduPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2012 ed. Dimensions: Width: 15.50cm , Height: 1.10cm , Length: 23.50cm Weight: 0.454kg ISBN: 9781489987228ISBN 10: 1489987223 Pages: 174 Publication Date: 20 October 2014 Audience: College/higher education , Postgraduate, Research & Scholarly Format: Paperback Publisher's Status: Active Availability: Manufactured on demand ![]() We will order this item for you from a manufactured on demand supplier. Table of ContentsThe Role of Temperature in Electronic Design.- Temperature Effects in Semiconductors.- Sensing Temperature Dependence.- Variation-Tolerant Adaptive Voltage Systems.- Controlling the Temperature Dependence.- Exploiting Temperature Dependence in Low-Swing Interconnect Links.- Avoiding Temperature-Induced Errors in On-Chip Interconnects.- Future Work and Open Problems.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |