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OverviewThe use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics. Full Product DetailsAuthor: Moonhor Ree , Jinhwan Yoon , Kyuyoung HeoPublisher: Nova Science Publishers Inc Imprint: Nova Science Publishers Inc Dimensions: Width: 23.00cm , Height: 0.50cm , Length: 15.50cm Weight: 0.138kg ISBN: 9781616687496ISBN 10: 1616687495 Pages: 67 Publication Date: 19 March 2011 Audience: College/higher education , Undergraduate , Postgraduate, Research & Scholarly Format: Paperback Publisher's Status: Active Availability: Awaiting stock The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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