Lead-free Soldering Process Development and Reliability
Author:   Jasbir Bath (Flextronics International, formerly called Solectron)
Publisher:   John Wiley & Sons Inc
ISBN:  

9781119482031


Pages:   512
Publication Date:   28 August 2020
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Lead-free Soldering Process Development and Reliability


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Author:   Jasbir Bath (Flextronics International, formerly called Solectron)
Publisher:   John Wiley & Sons Inc
Imprint:   John Wiley & Sons Inc
Dimensions:   Width: 16.00cm , Height: 2.80cm , Length: 23.10cm
Weight:   0.907kg
ISBN:  

9781119482031


ISBN 10:   1119482038
Pages:   512
Publication Date:   28 August 2020
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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JASBIR BATH, is the owner of Bath Consultancy LLC which provides consulting and training services in the electronics manufacturing industry. He was the Corporate Lead Engineer with Solectron Corporation/ Flex for ten years with a role involving tin-lead and lead-free solder process development. Previously he was a Technical Officer at ITRI (International Tin Research Institute/ Tin Technology) Ltd in the U.K.

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