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OverviewThe International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. ASM International and EDFAS has made the very difficult decision to cancel ISTFA 2020, that was scheduled for November 15-19, 2020 in Pasadena, California due to Covid -19 restrictions. This ISTFA 2020 publication includes the papers that were accepted for the planned 2020 conference. The theme of the planned conference was The Rise of MEMS (Microelectromechanical Systems) and 3D Failure Analysis. ISTFA 2021 will take place October 31- November 4, 2021 in Phoenix, Arizona. Full Product DetailsAuthor: ASM InternationalPublisher: A S M International Imprint: A S M International Weight: 0.970kg ISBN: 9781627083331ISBN 10: 1627083332 Pages: 396 Publication Date: 30 October 2020 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Out of stock ![]() The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |