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OverviewFull Product DetailsAuthor: Mohamed Elgamel , Magdy A. BayoumiPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 1st ed. Softcover of orig. ed. 2006 Dimensions: Width: 15.50cm , Height: 0.80cm , Length: 23.50cm Weight: 0.454kg ISBN: 9781441938442ISBN 10: 1441938443 Pages: 137 Publication Date: 29 October 2010 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Out of print, replaced by POD ![]() We will order this item for you from a manufatured on demand supplier. Table of ContentsNoise Analysis and Design in Deep Submicron.- Interconnect Noise Analysis and Optimization Techniques.- Crosstalk Noise Analysis in Ultra Deep Submicrometer Technologies.- Minimum Area Shield Insertion for Inductive Noise Reduction.- Spacing Algorithms for Crosstalk Noise Reduction.- Post Layout Interconnect Optimization for Crosscoupling Noise Reduction.- 3D Integration.- EDA Industry Tools: State of the ART.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |