Heat Transfer
Author:   Adrian Bejan
Publisher:   John Wiley and Sons Ltd
ISBN:  

9780471502906


Pages:   704
Publication Date:   11 February 1993
Format:   Paperback
Availability:   Out of print, replaced by POD   Availability explained
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Heat Transfer


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Overview

Laminar air flow through plate fins in the microchannel heat sink built into the back of an integrated circuit chip. This figure shows the pressure distribution; the corresponding temperature distribution is shown on the front cover, where the flow direction is upward. The Reynolds number based on the swept length of the plate fin is 150. The optimization of a related microchannel geometry is proposed in Project 6. 4 in the text.

Full Product Details

Author:   Adrian Bejan
Publisher:   John Wiley and Sons Ltd
Imprint:   John Wiley and Sons (WIE)
Dimensions:   Width: 18.20cm , Height: 3.70cm , Length: 25.50cm
Weight:   1.226kg
ISBN:  

9780471502906


ISBN 10:   0471502901
Pages:   704
Publication Date:   11 February 1993
Audience:   College/higher education ,  Undergraduate
Format:   Paperback
Publisher's Status:   Out of Stock Indefinitely
Availability:   Out of print, replaced by POD   Availability explained
We will order this item for you from a manufatured on demand supplier.

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