Haptics Technologies: Bringing Touch to Multimedia

Author:   Abdulmotaleb El Saddik ,  Mauricio Orozco ,  Mohamad Eid ,  Jongeun Cha
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
ISBN:  

9783642270314


Pages:   220
Publication Date:   27 November 2013
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Haptics Technologies: Bringing Touch to Multimedia


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Author:   Abdulmotaleb El Saddik ,  Mauricio Orozco ,  Mohamad Eid ,  Jongeun Cha
Publisher:   Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Imprint:   Springer-Verlag Berlin and Heidelberg GmbH & Co. K
Dimensions:   Width: 15.50cm , Height: 1.30cm , Length: 23.50cm
Weight:   0.454kg
ISBN:  

9783642270314


ISBN 10:   364227031
Pages:   220
Publication Date:   27 November 2013
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Abdulmotaleb El Saddik is University Research Chair and Professor, SITE, University of Ottawa, Canada.  He is the director of the Multimedia Communications Research Laboratory (MCRLab). He has been the General Chair and/or Technical Program Chair of more than 25 international conferences, symposia and workshops on collaborative hapto-audio-visual environments, multimedia communications and instrumentation and measurement. He has authored and co-authored more than 250 publications, and his research has been selected for Best Paper Award three times. In addition, Abdulmotaleb was the recipient of the Professional of the Year Award (2008), the Friedrich Wilhelm-Bessel Research Award from Germany's Alexander von Humboldt Foundation (2007), the Premier’s Research Excellence Award (PREA 2004), and the National Capital Institute of Telecommunications (NCIT) New Professorship Incentive Award (2004). He is a Senior Member of ACM, an IEEE Distinguished Lecturer, Fellow of the Canadian Academy of Engineering, Fellow of the Engineering Institute of Canada, and Fellow of IEEE.

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