Overview

Chapter I describes deposition as a basic microelectronics technique. Plasma enhanced chemical vapor deposition (PECVD) is a technique widely accepted in microelectronics for the deposition of amorphous dielectric films such as silicon nitride and silicon oxide. The main advantage of PECVD stems from the intro­ duction of plasma energy to the CVD environment, which makes it possible to promote chemical reactions at relatively low temperatures. A natural extension of this is to use this plasma energy to lower the temperature required to obtain a crystalline deposit. This chapter discusses the PECVD technique and its ap­ plication to the deposition of dielectric, semiconductor, and conductor films of interest to microelectronics. Chapter 2 acquaints the reader with the technology and capabilities of plasma processing. Batch etching reactors and etching processes are approaching ma­ turity after more than ten years of development. Requirements of anisotropic and selective etching have been met using a variety of reactor configurations and etching gases. The present emphasis is the integration of plasma etching processes into the overall fabrication sequence. Chapter 3 reviews recent advances in high pressure oxidation technology and its applications to integrated circuits. The high pressure oxidation system, oxi­ dation mechanisms, oxidation-induced stacking faults, impurity segregation, and oxide quality are described. Applications to bipolar and MOS devices are also presented.

Full Product Details

Author:   Guy Rabbat
Publisher:   Springer
Imprint:   Springer
Edition:   Softcover reprint of the original 1st ed. 1988
Dimensions:   Width: 15.50cm , Height: 4.80cm , Length: 23.50cm
Weight:   1.442kg
ISBN:  

9789401170581

ISBN 10:   9401170584
Pages:   942
Publication Date:   24 June 2012
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
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Table of Contents

1. Deposition for Microelectronics—Plasma Enhanced Chemical Vapor Deposition.- 2. Etching—Applications and Trends of Dry Etching.- 3. Oxidation Technology—The Application of High Pressure Oxidation to VLSI.- 4. Structures and Fabrication of Metal-Oxide-Silicon Field-Effect Transistor.- 5. Electron Beam Testing.- 6. Metallization for Very Large-Scale Integrated Circuits.- 7. MOS Technology Advances.- 8. CMOS Devices.- 9. Bipolar Gate Array Technology.- 10. Packaging Technologies for High-Performance Computers.- 11. Packaging Cost-Performance Computers.- 12. Microprocessors.- 13. Programmable Logic Arrays (PLAs)—Design and Application.- 14. Design for Testability.- 15. Silicon Design Methods and Computer-Aided Design Tools.- 16. Design Verification of VLSI Circuits.- 17. The Complexity of Design Automation Problems.- 18. Hierarchical Automatic Layout Algorithms for Custom Logic LSI.- 19. Layout Compiler-Annealing Applied to Floorplan Design.- 20. Automatic Placement.- 21. High Density Routing for Printed Wiring Board.- 22. Cell Based Physical Design for VLSI.- 23. Logic Design Expert System.- 24. Fault-Tolerant Multiple Processor Systems—Modeling and Analysis.- 25. Parallel Execution of Logic Programs.- 26. Organization and Operation of Massively Parallel Machines.- 27. Advances in Signal Processor Architecture.

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