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OverviewMost design engineers are tasked to design against failure, and one of the biggest causes of product failure is failure of the material due to fatigue/fracture. From leading experts in fracture mechanics, this new text provides new approaches and new applications to advance the understanding of crack initiation and propagation. With applications in composite materials, layered structures, and microelectronic packaging, among others, this timely coverage is an important resource for anyone studying or applying concepts of fracture mechanics. Concise and easily understood mathematical treatment of crack tip fields (chapter 3) provides the basis for applying fracture mechanics in solving practical problemsUnique coverage of bi-material interfacial cracks (chapter 8), with applications to commercially important areas of composite materials, layered structures, and microelectronic packaging A full chapter (chapter 9) on the cohesive zone model approach, which has been extensively used in recent years to simulate crack propagationA unified discussion of fracture criteria involving nonlinear/plastic deformations Full Product DetailsAuthor: Chin-Teh Sun , Zhihe JinPublisher: Academic Press Imprint: Academic Press ISBN: 9781283288170ISBN 10: 1283288176 Pages: 336 Publication Date: 01 January 2011 Audience: General/trade , General Format: Electronic book text Publisher's Status: Active Availability: Available To Order ![]() We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |