|
![]() |
|||
|
||||
OverviewThis book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described. Full Product DetailsAuthor: Seiji SamukawaPublisher: Springer Verlag, Japan Imprint: Springer Verlag, Japan Edition: 2014 ed. Dimensions: Width: 15.50cm , Height: 0.30cm , Length: 23.50cm Weight: 0.949kg ISBN: 9784431547945ISBN 10: 4431547940 Pages: 40 Publication Date: 17 February 2014 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand ![]() We will order this item for you from a manufactured on demand supplier. Table of ContentsIntroduction.- On-wafer UV sensor and prediction of UV irradiation damage.- Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System.- Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.ReviewsAuthor InformationProf. Seiji Samukawa Distinguished Professor in Tohoku University Professor in Institute of Fluid Science, Professor and Principal Investigator, WPI-AIMR in Tohoku University. Tab Content 6Author Website:Countries AvailableAll regions |