Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System

Author:   Seiji Samukawa
Publisher:   Springer Verlag, Japan
Edition:   2014 ed.
ISBN:  

9784431547945


Pages:   40
Publication Date:   17 February 2014
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Our Price $145.17 Quantity:  
Add to Cart

Share |

Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System


Add your own review!

Overview

This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.

Full Product Details

Author:   Seiji Samukawa
Publisher:   Springer Verlag, Japan
Imprint:   Springer Verlag, Japan
Edition:   2014 ed.
Dimensions:   Width: 15.50cm , Height: 0.30cm , Length: 23.50cm
Weight:   0.949kg
ISBN:  

9784431547945


ISBN 10:   4431547940
Pages:   40
Publication Date:   17 February 2014
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Introduction.- On-wafer UV sensor and prediction of UV irradiation damage.- Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System.- Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.

Reviews

Author Information

Prof. Seiji Samukawa Distinguished Professor in Tohoku University Professor in Institute of Fluid Science, Professor and Principal Investigator, WPI-AIMR in Tohoku University.

Tab Content 6

Author Website:  

Customer Reviews

Recent Reviews

No review item found!

Add your own review!

Countries Available

All regions
Latest Reading Guide

MRG2025CC

 

Shopping Cart
Your cart is empty
Shopping cart
Mailing List