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OverviewFull Product DetailsAuthor: Karel Dusek , R. Dave , M.P. Dudukovic , H. FurukawaPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: Softcover reprint of the original 1st ed. 1986 Volume: 80 Dimensions: Width: 17.00cm , Height: 1.30cm , Length: 24.40cm Weight: 0.415kg ISBN: 9783662151808ISBN 10: 3662151804 Pages: 220 Publication Date: 17 April 2014 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand ![]() We will order this item for you from a manufactured on demand supplier. Table of ContentsDielectric analysis of thermoset cure.- Epoxy-aromatic amine networks in the glassy state structure and properties.- Void growth and resin transport during processing of thermosetting — Matrix composites.- Physical aging in epoxy matrices and composites.- Curing mechanisms and mechanical properties of cured epoxy resins.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |