Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product. Unmodified, epoxy resins cause certain problems for both the adhesive formulator and end-user. They are often rigid and brittle; hence, impact resistance and peel strength are poor. For decades, Chemist have been vigorously working to minimize these major shortcomings. Based on a popular course sponsored by the Society of Plastics Engineers and written by an authority in the field, this comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. Beginning with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating Epoxy Adhesives, this rigorous text addressed the problem of improving flexibility, durability and strength by adding chemical groups to the epoxy structure either via the base resin or the curing agent or by adding separate flexibilizing resins to the formulation to create an epoxy-hybrid adhesive.

Full Product Details

Author:   Edward Petrie
Publisher:   McGraw-Hill Education - Europe
Imprint:   McGraw-Hill Professional
Dimensions:   Width: 16.00cm , Height: 4.20cm , Length: 22.40cm
Weight:   0.846kg
ISBN:  

9780071455442

ISBN 10:   0071455442
Pages:   535
Publication Date:   16 October 2005
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Chapter 1: Epoxy AdhesivesChapter 2: Epoxy Resin ChemistryChapter 3: Important Properties of Epoxy AdhesivesChapter 4: Epoxy ResinsChapter 5: Epoxy Curing Agents and CatalystsChapter 6: Solvents and DilutentsChapter 7: Hybrid ResinsChapter 8: Flexibilizers and ToughenersChapter 9: Fillers and ExtendersChapter 10: Adhesion Promoters and PrimersChapter 11: Room Temperature Curing Epoxy AdhesivesChapter 12: Elevated-Temperature Curing Liquid and Paste Epoxy AdhesivesChapter 13: Solid Epoxy Adhesive SystemsChapter 14: Unconventional Epoxy AdhesivesChapter 15: Effect of the Service EnvironmentChapter 16: Epoxy Adhesives on Selected SubstratesChapter 17: Processing of Epoxy AdhesivesChapter 18: Health and Safety IssuesChapter 19: Quality Control and SpecificationChapter 20: TestingAPPENDIX A: TRADE NAMES AND MANUFACTURERS: EPOXY ADHESIVES, EPOXY RESINS, CURING AGENTS AND CATALYSTS, ADDITIVES AND MODIFIERSAPPENDIX B: PROPERTIES OF SELECTED COMMERCIAL EPOXY ADHESIVE FORMULATIONSAPPENDIX C: SELECTED EPOXY RESINSAPPENDIX D: EPOXY CURING AGENTSAPPENDIX E: INDEX TO FORMULATIONSAPPENDIX F: SURFACE PREPARATION METHODS FOR COMMON SUBSTRATE MATERIALSAPPENDIX G: SPECIFICATIONS AND STANDARDSAPPENDIX H: CONVERSION FACTORSINDEX

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