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OverviewFull Product DetailsAuthor: King-Ning Tu (City University of Hong Kong) , Yingxia Liu (City University of Hong Kong)Publisher: Taylor & Francis Ltd Imprint: CRC Press Weight: 0.421kg ISBN: 9781032470276ISBN 10: 1032470275 Pages: 132 Publication Date: 19 January 2024 Audience: College/higher education , Professional and scholarly , Tertiary & Higher Education , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1. Introduction 2. Driving forces of electromigration 3. Kinetics of electromigration 4. Damage of electromigration 5. Irreversible processes 6. Effect of stress on electromigration 7. Effect of current crowding on electromigration 8. Effect of Joule heating on electromigration 9. Effect of Oxidation on Electromigration 10. Modified Mean-Time-to-Failure EquationsReviewsAuthor InformationKing-Ning Tu is Professor Emeritus at UCLA and Chair Professor of Materials and Electrical Engineering of City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1960, 1964, and 1968, respectively. Professor Tu is a world leader in the science of thin films, especially in their applications in microelectronic devices, packaging, and reliability. Dr. Yingxia Liu is an Assistant Professor at City University of Hong Kong. Dr. Liu received her Ph.D. from the Department of Materials Science and Engineering, University of California, Los Angeles in 2016 and her Bachelor’s degree from the College of Chemistry and Molecular Engineering, Peking University in 2012. Tab Content 6Author Website:Countries AvailableAll regions |
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