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OverviewElectromagnetic Wave Absorbing Materials Electromagnetic Wave Absorbing Materials presents information on the most promising electromagnetic wave absorbing materials, with timely coverage of both conventional and novel materials including 1D, 2D, and 3D materials. This book enables readers to address the growing specification needs in the field through optimizing electromagnetic parameters and promoting interface polarization, two key properties for wireless technology in electronic applications. Edited by three highly qualified academics with significant relevant research experience, Electromagnetic Wave Absorbing Materials includes discussions on: Materials including ferrites, graphene, carbon‐based composite absorbers, SiC ceramics, MOFs, and meta‐material based absorbers Recent advances in the field surrounding composite absorbers, conductive polymers, and ceramics, and other materials Potential improvements in the Internet of Things, 5G mobile applications, and intelligent transport systems through electromagnetic wave absorbing materials Potential improvements in the Internet of Things, 5G mobile applications, and intelligent transport systems through electromagnetic wave absorbing materials Applications including terrestrial and satellite communication (software radio, GPS, and satellite TV), environmental monitoring via satellite, and EMI shielding, as well as stealth applications Electromagnetic Wave Absorbing Materials is an essential reference on the subject for researchers and advanced students in the chemical, electronics, and communications industries, as well as R&D scientists at companies such as Apple, HUAWEI, and China Aerospace Science and Technology Corp (CASC). Full Product DetailsAuthor: Hongjing Wu (Northwestern Polytechnical University, China) , Jun Luo (Chinese Academy of Sciences, China) , Meiyin Yang (Chinese Academy of Sciences, China)Publisher: John Wiley & Sons Inc Imprint: John Wiley & Sons Inc Dimensions: Width: 17.00cm , Height: 2.00cm , Length: 24.40cm Weight: 0.680kg ISBN: 9781119699347ISBN 10: 1119699347 Pages: 272 Publication Date: 26 September 2024 Audience: College/higher education , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: Available To Order ![]() We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviewsAuthor InformationEdited by Hongjing Wu Northwestern Polytechnical University, China Jun Luo Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), China Meiyin Yang Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), China Series Editors Arthur Willoughby University of Southampton, Southampton, UK Peter Capper formerly of Leonardo M. W. Ltd, Southampton, UK Safa Kasap University of Saskatchewan, Saskatoon, Canada Tab Content 6Author Website:Countries AvailableAll regions |