Electromagnetic Metamaterials and Metasurfaces: From Theory To Applications

Author:   Long Li ,  Yan Shi ,  Tie Jun Cui
Publisher:   Springer Verlag, Singapore
Edition:   1st ed. 2024
ISBN:  

9789819979134


Pages:   516
Publication Date:   19 February 2024
Format:   Hardback
Availability:   Manufactured on demand   Availability explained
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Electromagnetic Metamaterials and Metasurfaces: From Theory To Applications


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Author:   Long Li ,  Yan Shi ,  Tie Jun Cui
Publisher:   Springer Verlag, Singapore
Imprint:   Springer Verlag, Singapore
Edition:   1st ed. 2024
Weight:   1.046kg
ISBN:  

9789819979134


ISBN 10:   9819979137
Pages:   516
Publication Date:   19 February 2024
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Long Li  received the B. E. and Ph.D. degrees in electromagnetic fields and microwave technology from Xidian University, Xi’an, China, in 1998 and 2005, respectively. He was Senior Research Associate in the Wireless Communications Research Center, City University of Hong Kong in 2006. He received the Japan Society for Promotion of Science (JSPS) Postdoctoral Fellowship and visited Tohoku University, Sendai, Japan, as JSPS Fellow from 2006 to 2008. He was Senior Visiting Scholar in the Pennsylvania State University, USA, in 2014. He is currently Professor and Vice-Dean of the School of Electronic Engineering, Xidian University. He is Director of Key Laboratory of High-Speed Circuit Design and EMC, Ministry of Education, China. His research interests include metamaterials/metasurfaces, antennas and microwave devices, field-circuit collaborative design and EMC, wireless power transfer and harvesting technology, and OAM vortex waves. He has authored or co-authored over180 papers in journals and held more than 40 patents. Prof. Li is the IET Fellow and IAAM Fellow. Yan Shi received the B. Eng. and Ph.D. degrees in electromagnetic fields and microwave technology from Xidian University, Xi’an, China, in 2001 and 2005, respectively. He joined the School of Electronic Engineering, Xidian University, in 2005, and became Full Professor in 2011. From 2007 to 2008, he was Senior Research Associate with the City University of Hong Kong, Hong Kong. From 2009 to 2010, he was Visiting Postdoctoral Research Associate with the University of Illinois at Urbana–Champaign, Champaign, IL, USA. From June 2017 to July 2017, he was Visiting Professor at State Key Laboratory of Millimeter Wave of City University of Hong Kong, Hong Kong, China. He has authored or co-authored over 100 papers in refereed journal and 1 book entitled Notes on Catastrophe Theory (Sci. Press, 2015). His current research interests include computational electromagnetics, metamaterial, antenna, and electromagnetic compatibility. He is Senior Member of the Chinese Institute of Electronics (CIE) and IEEE.    Tie Jun Cui received the B.Sc., M.Sc., and Ph.D. degrees in electrical engineering from Xidian University, Xi’an, China, in 1987, 1990, and 1993, respectively. From 1995 to 1997, he was Research Fellow with the Institut fur Hochstfrequenztechnik und Elektronik (IHE) at University of Karlsruhe, Germany. In 1997, he joined the Center for Computational Electromagnetics, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, first as Postdoctoral Research Associate and then Research Scientist. In 2001, he was Cheung-Kong Professor with the Department of Radio Engineering, Southeast University, Nanjing, China. Currently, he is Chief Professor of Southeast University. He is also Founding Director of the Institute of Electromagnetic Space, Southeast University. His research interestsinclude metamaterials and computational electromagnetics. He has published over 600 peer-review journal papers, which have been cited by more than 50000 times, and licensed over 90 patents. Prof. Cui is the Academician of Chinese Academy of Science, and IEEE Fellow.  

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