Overview
Development of Packaging and Products for Use in Microwave Ovens, Second Edition, supports the efficient design of microwaveable food products and packaging materials, explaining all essential aspects in a detailed and systematic way. This new edition reviews recent developments and the latest cutting-edge technology, including new materials and package formats, new ideas for product development, and new information on developments in microwave technology. Sections cover the effect of food dielectric properties and heating uniformity, microwave packaging materials, product development, food, packaging, oven safety, and the computer modelling of microwave products and active packaging. Written by a distinguished team of international contributors, this book is not only a valuable resource for engineers, manufacturers and product developers in the food and packaging industries, but also a great research tool for industrial R&D and academia.
Full Product Details
Author: Ulrich Erle (Expert for cooking technologies and food science, Nestlé Development Center in Solon/Ohio) ,
P. S. Pesheck (General Mills, USA) ,
M. W. Lorence (Packaging Technology Manager at Bellisio Foods, Inc)
Publisher: Elsevier Science & Technology
Imprint: Woodhead Publishing Ltd
Edition: 2nd edition
Weight: 0.940kg
ISBN: 9780081027134
ISBN 10: 0081027133
Pages: 590
Publication Date: 27 May 2020
Audience:
Professional and scholarly
,
Professional & Vocational
Format: Paperback
Publisher's Status: Active
Availability: Manufactured on demand
We will order this item for you from a manufactured on demand supplier.
Author Information
Ulrich Erle is an expert for cooking technologies and food science at the Nestlé Development Center in Solon/Ohio. During his assignments as project manager and senior scientific advisor he gained experience in the industrial application of microwaves in vacuum drying and sterilization processes. More recently, he concentrated on the performance of food products for household microwave ovens, including innovative packaging solutions. Ulrich is a member of the Board of Governors of the International Microwave Power Institute (IMPI) and also chaired the 50th IMPI Symposium in Orlando. He represents Nestlé in the Center for Advanced Processing and Packaging Studies (CAPPS) and in the RF Energy Alliance. Peter Pesheck is currently Principal at Food Biophysics, LLC. In his 34-year R&D career at Pillsbury and General Mills he worked primarily in cross-business Strategic Technology groups, where he specialized in structure-function relationships, microscopy, modeling, microwave heating (food dielectric properties, simulation, product design and problem resolution), and wheat flour doughs and their structural transformations in proofing and baking. He has published 4 papers in reviewed journals and holds 19 U.S. patents. Matthew Lorence is currently a Packaging Technology Manager at Bellisio Foods, Inc. He is a leader in the field of packaging R&D for consumer and industrial products, and medical devices. He was previously Packaging Technology Manager at General Mills. He holds 13 U.S. patents and has extensive experience in identifying, developing, and commercializing convenient Total Product Offerings leveraging Open Innovation for new packaging and product technologies.
