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OverviewFull Product DetailsAuthor: Rohit Sharma (Indian Institute of Technology Ropar, Punjab, India) , Krzysztof Iniewski (Emerging Technologies CMOS Inc., British Columbia, Canada) , Sung Kyu LimPublisher: Taylor & Francis Inc Imprint: CRC Press Inc Volume: 33 Dimensions: Width: 15.60cm , Height: 2.50cm , Length: 23.40cm Weight: 0.600kg ISBN: 9781466589407ISBN 10: 146658940 Pages: 324 Publication Date: 12 November 2014 Audience: Professional and scholarly , College/higher education , Professional & Vocational , Tertiary & Higher Education Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents3D Integration Technology with TSV and IMC Bonding. Wafer-Level 3D ICs for Advanced CMOS Integration. Integration of Graphics Processing Cores with Microprocessors. Electrothermal Simulation of 3D ICs. Thermal Management in 3D ICs/Systems. Emerging Interconnect Technologies for 3D Networks-on-Chips. Inductive-Coupling ThruChip Interface for 3D Integration. Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via. Low-Power Testing for 2D/3D Devices and Systems.ReviewsAuthor InformationRohit Sharma is faculty at the Indian Institute of Technology Ropar, Punjab. He previously worked as a post-doctoral researcher at Seoul National University, South Korea and at Georgia Institute of Technology, Atlanta, USA. Dr. Sharma has authored/co-authored over 50 journal and conference publications, one book, one book chapter, two patents/copyrights, and several invited talks. He was a recipient of the Brain Korea Research Fellowship (2010), the Indo-US Research Fellowship (2011), and Best Paper Awards in ASQED 2010 and GIT 2011 conferences. An IEEE and ACM member, he has served as a journal referee and committee member/session co-chair on multiple occasions. Tab Content 6Author Website:Countries AvailableAll regions |
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