Design and Application of Intelligent Thermally Conductive Materials

Author:   Wei Feng, PhD (Tianjin University, China)
Publisher:   Elsevier - Health Sciences Division
ISBN:  

9780443404092


Pages:   374
Publication Date:   02 June 2025
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Our Price $660.00 Quantity:  
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Design and Application of Intelligent Thermally Conductive Materials


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Design and Application of Intelligent Thermally Conductive Materials

Full Product Details

Author:   Wei Feng, PhD (Tianjin University, China)
Publisher:   Elsevier - Health Sciences Division
Imprint:   Elsevier - Health Sciences Division
Weight:   0.290kg
ISBN:  

9780443404092


ISBN 10:   0443404097
Pages:   374
Publication Date:   02 June 2025
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

1. Overview of thermal conductivity 2. Overview of intelligent thermal conductive materials 3. Design of intelligent performance 4. Design of intelligent thermal conductive materials 5. Application of intelligent thermal conductive materials 6. Application of intelligent thermal conductive materials in advanced chips 7. Conclusions and outlook

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Author Information

Professor Wei Feng based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials

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