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OverviewFull Product DetailsAuthor: Richard F. Yanda (Semiconductor Services, Redwood City, CA, USA) , Michael Heynes (Semiconductor Services, Redwood City, CA, USA) , Anne Miller (Semiconductor Services, Redwood City, CA, USA)Publisher: Elsevier Science & Technology Imprint: Newnes (an imprint of Butterworth-Heinemann Ltd ) Dimensions: Width: 19.10cm , Height: 1.70cm , Length: 23.50cm Weight: 0.680kg ISBN: 9780750677608ISBN 10: 0750677600 Pages: 280 Publication Date: 07 January 2021 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Out of stock ![]() The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of Contents1. IC Fabrication Overview 2. Support Technologies 3. Forming Wells 4. Isolate Active Areas (Shallow Trench Isolation) 5. Building the Transistors 6. First Level Metallization 7. Multilevel Metal Interconnects and Dual Damascene 8. Test and Assembly APPENDIX A: Science Overview B: Plasma Etch Supplement to Chapter 4Reviews...a useful guide for engineers just entering the packaging sector of the semiconductor industry or for newly vetted engineering school grads. - Ron Iscoff, Editor, Chip Scale Review Demystifying Chipmaking...will provide an interesting overview of the IC fabrication process while familiarizing you with the terminology. - Rick Nelson, Chief Editor, Test & Measurement World Author InformationTab Content 6Author Website:Countries AvailableAll regions |