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OverviewThis book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley. The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included. The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design. Full Product DetailsAuthor: Richard F. Yanda (Semiconductor Services, Redwood City, CA, USA) , Michael Heynes (Semiconductor Services, Redwood City, CA, USA) , Anne Miller (Semiconductor Services, Redwood City, CA, USA)Publisher: Elsevier Science & Technology Imprint: Newnes (an imprint of Butterworth-Heinemann Ltd ) Dimensions: Width: 19.10cm , Height: 1.70cm , Length: 23.50cm Weight: 0.680kg ISBN: 9780750677608ISBN 10: 0750677600 Pages: 280 Publication Date: 07 January 2021 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of Contents1. IC Fabrication Overview 2. Support Technologies 3. Forming Wells 4. Isolate Active Areas (Shallow Trench Isolation) 5. Building the Transistors 6. First Level Metallization 7. Multilevel Metal Interconnects and Dual Damascene 8. Test and Assembly APPENDIX A: Science Overview B: Plasma Etch Supplement to Chapter 4Reviews...a useful guide for engineers just entering the packaging sector of the semiconductor industry or for newly vetted engineering school grads. - Ron Iscoff, Editor, Chip Scale Review Demystifying Chipmaking...will provide an interesting overview of the IC fabrication process while familiarizing you with the terminology. - Rick Nelson, Chief Editor, Test & Measurement World Author InformationTab Content 6Author Website:Countries AvailableAll regions |
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