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OverviewFull Product DetailsAuthor: Leendert M. HuismanPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of hardcover 1st ed. 2005 Volume: 31 Dimensions: Width: 15.50cm , Height: 1.40cm , Length: 23.50cm Weight: 0.454kg ISBN: 9781441937674ISBN 10: 1441937676 Pages: 250 Publication Date: 08 December 2010 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsIntroduction.- Statistics.- Yield Statistics.- Area Dependence of the Yield.- Statistics of Embedded Object Fails.- Fail Commonalities.- Spatial Patterns.- Test Coverage and Test Fallout.- Logic Diagnosis.- Slat Based Diagnosis.- Data Collection Requirements.- Appendix A. Distribution of IC Fails.- Appendix B. General Yield Model.- Appendix C. Simplified Center-Satellite Model.- Appendix D. Quadrat Analysis.- Appendix E. Cell Fail Probabilities.- Appendix F. Characterization Group.- Appendix G. Component Fail Probabilities.- Appendix H. Yield and Coverage.- Appendix I. Estimating First Fail Probabilities from the Fallout.- Appendix J. Identity of M and S.- References.- Index.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |