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9781493953493

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From the reviews: The book gives a wide perspective on the technical insights of copper wire bonding deployment in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of copper wire bonding, and can serve as a very informative technical reference. Valuable as a learning tool for copper wire bonding, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners. (Chong Leong Gan, Classe Francis, Bak Lee Chan and Hashim Uda, Microelectronics Reliability, November, 2013)

From the reviews: The book gives a wide perspective on the technical insights of copper wire bonding deployment in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of copper wire bonding, and can serve as a very informative technical reference. Valuable as a learning tool for copper wire bonding, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners. (Chong Leong Gan, Classe Francis, Bak Lee Chan and Hashim Uda, Microelectronics Reliability, November, 2013)

Author Information

Preeti Chauhan is a researcher from the Center for Advanced Life Cycle Engineering at the University of Maryland. She is currently a technology development Q&R engineer at Intel Corporation. Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological University. Michael Pecht is a world renowned reliability engineer and educator. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.

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