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OverviewFull Product DetailsAuthor: Seiichi NomuraPublisher: Springer International Publishing AG Imprint: Springer International Publishing AG Edition: 1st ed. 2022 Weight: 0.314kg ISBN: 9783031130694ISBN 10: 3031130693 Pages: 172 Publication Date: 02 October 2023 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsReviewsAuthor InformationSeiichi Nomura is a Professor in the Department of Mechanical and Aerospace Engineering at the University of Texas at Arlington. He is the author of Micromechanics with Mathematica, co-author of Heat Conduction in Composite Materials with A. Haj--Sheikh, and author of C Programming and Numerical Analysis. His research interests include miromechanics, analysis of composite materials and applications of computer algebra systems. He holds a Dr. of Eng. degree from the University of Tokyo and a Ph.D. from the University of Deleware. Tab Content 6Author Website:Countries AvailableAll regions |
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