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OverviewFull Product DetailsAuthor: Fred D. Barlow, III (University of Idaho, Moscow, USA) , Aicha Elshabini (University of Arkansas, Fayetteville, USA) , Arne K. Knudsen (San Diego, California, USA) , Aicha Elshabini (University of Arkansas, Fayetteville, USA)Publisher: Taylor & Francis Inc Imprint: CRC Press Inc Dimensions: Width: 15.60cm , Height: 2.90cm , Length: 23.40cm Weight: 0.771kg ISBN: 9780849335570ISBN 10: 0849335574 Pages: 456 Publication Date: 24 January 2007 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsOverview of Ceramic Interconnect Technology. Electrical Design, Simulation, and Testing. ThermoMechanical Design. Ceramic Materials. Screen Printing. Multilayer Ceramics. Photo-Defined and Photo-Imaged Films. Copper Interconnects for Ceramic Substrates and Packages. Integrated Passives in Ceramic Substrates. Index.ReviewsAuthor InformationUniversity of Idaho, Moscow, USA University of Arkansas, Fayetteville, USA Tab Content 6Author Website:Countries AvailableAll regions |