ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)
Author:   American Society of Mechanical Engineers
Publisher:   American Society of Mechanical Engineers,U.S.
ISBN:  

9780791884041


Pages:   566
Publication Date:   31 July 2024
Format:   Paperback
Availability:   In Print   Availability explained
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ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)


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Overview

65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

Full Product Details

Author:   American Society of Mechanical Engineers
Publisher:   American Society of Mechanical Engineers,U.S.
Imprint:   American Society of Mechanical Engineers,U.S.
Weight:   0.800kg
ISBN:  

9780791884041


ISBN 10:   079188404
Pages:   566
Publication Date:   31 July 2024
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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