Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author:   Khaled Salah ,  Yehea Ismail ,  Alaa El-Rouby
Publisher:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2015
ISBN:  

9783319374970


Pages:   179
Publication Date:   23 August 2016
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Arbitrary Modeling of TSVs for 3D Integrated Circuits


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Author:   Khaled Salah ,  Yehea Ismail ,  Alaa El-Rouby
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   Softcover reprint of the original 1st ed. 2015
Dimensions:   Width: 15.50cm , Height: 1.00cm , Length: 23.50cm
Weight:   2.993kg
ISBN:  

9783319374970


ISBN 10:   3319374974
Pages:   179
Publication Date:   23 August 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Introduction: Work around Moore’s Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.

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