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Author:   Myer Kutz (Owner, Myer Kutz Associates. Inc., Delmar, NY, USA)
Publisher:   William Andrew Publishing
Imprint:   William Andrew Publishing
Edition:   2nd edition
Dimensions:   Width: 21.60cm , Height: 4.10cm , Length: 27.60cm
Weight:   2.380kg
ISBN:  

9780323390408

ISBN 10:   0323390404
Pages:   784
Publication Date:   04 October 2016
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Replaced By:   9780323886673
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Part I: Plastics, elastomeric and biobased materials 1. Engineering Thermoplastics - Materials, Properties, Trends 2. Polyolefins 3. Introduction to Fluoropolymers 4. Poly(Vinyl Chloride) 5. Thermoplastic Elastomers 6. Thermoset Elastomers 7. Biodegradable and Biobased Polymers 8. Polymeric Biomaterials Part II: Plastics processing 9. Recycling of Plastics 10. Injection Molding Technology 11. Microcellular Injection Molding 12. Extrusion Processes 13. Blow Molding 14. Compression Molding 15. Rotational Molding16: Thermoforming 17. Process Monitoring and Process Control: An Overview 18. Polymer Stabilization 19. Chaotic Advection and Its Application to Extruding Micro- and Nanostructured Plastic Materials Part III: Additives, colorants and fillers 20. Surface Modification of Plastics 21. Plastics Additives 22. Dispersants and Coupling Agents 23. Functional Fillers for Plastics 24. Plasticizers 25. Adhesion Promoters: Silane Coupling Agents Part IV: Design and applications 26. Plastics Joining 27. Design of Plastic Parts 28. Three-Dimensional Printing of Plastics 29. Plastics in Buildings and Construction 30. Automotive Applications of Plastics: Past, Present, and Future 31. Infrastructure Applications of Fiber-Reinforced Polymer Composites 32. The Plastic Piping Industry in North America 33. PET Use in Blow Molded Rigid Packaging

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Author Information

Myer Kutz has been heading his own firm, Myer Kutz Associates, Inc., since 1990. For the past two decades, he has focused on writing and developing engineering handbooks on a wide range of technical topics, such as mechanical, materials, biomedical, transportation, and environmentally conscious engineering. Earlier, his firm supplied consulting services to a large client roster, including Fortune 500 companies, scientific societies, and large and small publishers. He has been a trustee of the Online Computer Library Center (OCLC) and chaired committees of the American Society of Mechanical Engineers (ASME) and the Association of American Publishers (AAP). He is a long-time judge for the AAP's annual PROSE Awards, and holds engineering degrees from MIT and RPI, served as an officer in the US Army Ordnance Corp, and worked in the aerospace industry on the Apollo project. He is the author of nine books. He writes “The Scholarly Publishing Scene”, a column for the magazine Against the Grain. He lives in Delmar, New York, with his wife, Arlene.

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