An Introduction to Bonding for Electronic Facilities
Author:   J Paul Guyer
Publisher:   Independently Published
ISBN:  

9781085970730


Pages:   56
Publication Date:   28 July 2019
Format:   Paperback
Availability:   Available To Order   Availability explained
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An Introduction to Bonding for Electronic Facilities


Overview

Introductory technical guidance for electrical engineers and construction managers interested in bonding in buildings housing electronic equipment such as computer rooms, data processing facilities and communications equipment. Here is what is discussed:1. DEFINITION OF BONDING2. PURPOSES OF BONDING3. RESISTANCE CRITERIA4. DIRECT BONDS5. INDIRECT BONDS6. SURFACE PREPARATION7. COMPLETION OF THE BOND8. BOND CORROSION9. WORKMANSHIP10. SUMMARY OF GUIDELINES.

Full Product Details

Author:   J Paul Guyer
Publisher:   Independently Published
Imprint:   Independently Published
Dimensions:   Width: 21.60cm , Height: 0.30cm , Length: 27.90cm
Weight:   0.154kg
ISBN:  

9781085970730


ISBN 10:   1085970736
Pages:   56
Publication Date:   28 July 2019
Audience:   General/trade ,  General
Format:   Paperback
Publisher's Status:   Active
Availability:   Available To Order   Availability explained
We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately.

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