Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects

Author:   Kieran Delaney
Publisher:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2008
Volume:   18
ISBN:  

9781441942777


Pages:   422
Publication Date:   23 November 2010
Format:   Paperback
Availability:   Out of print, replaced by POD   Availability explained
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Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects


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Overview

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept. Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user. Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would ""know"" itself, and its current status.

Full Product Details

Author:   Kieran Delaney
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of hardcover 1st ed. 2008
Volume:   18
Dimensions:   Width: 15.50cm , Height: 2.20cm , Length: 23.50cm
Weight:   0.664kg
ISBN:  

9781441942777


ISBN 10:   1441942777
Pages:   422
Publication Date:   23 November 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of print, replaced by POD   Availability explained
We will order this item for you from a manufatured on demand supplier.

Table of Contents

The Concepts.- An Overview of Pervasive Computing Systems.- Augmenting Materials to Build Cooperating Objects.- Device Technologies.- Overview of Component Level Devices.- Silicon Technologies for Microsystems, Microsensors and Nanoscale Devices.- Hardware Sub-Systems Technologies.- Distributed, Embedded Sensor and Actuator Platforms.- Embedded Microelectronic Subsystems.- Networking Technologies.- Embedded Wireless Networking: Principles, Protocols, and Standards.- Systems Technologies.- Context in Pervasive Environments.- Achieving Co-Operation and Developing Smart Behavior in Collections of Context-Aware Artifacts.- System-Level Challenges.- Power Management, Energy Conversion and Energy Scavenging for Smart Systems.- Challenges for Hardware Reliability in Networked Embedded Systems.- System Co-Design.- Co-Design: From Electronic Substrates to Smart Objects.- Co-Design for Context Awareness in Pervasive Systems.- User-Centered Systems.- User-Centred Design and Development of Future Smart Systems: Opportunities and Challenges.- Embedded Systems Research and Innovation Programmes for Industry.- Applied Systems.- Sensor Architectures for Interactive Environments.- Building Networkable Smart and Cooperating Objects.- Dedicated Networking Solutions for a Container Tracking System.

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