Advances in CMP Polishing Technologies
Author:   Toshiro Doi (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan) ,  Ioan D. Marinescu (University of Toledo, OH, USA) ,  Syuhei Kurokawa
Publisher:   William Andrew Publishing
ISBN:  

9780128103562


Pages:   328
Publication Date:   30 October 2017
Format:   Paperback
Availability:   Available To Order   Availability explained
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Advances in CMP Polishing Technologies


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Overview

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Full Product Details

Author:   Toshiro Doi (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan) ,  Ioan D. Marinescu (University of Toledo, OH, USA) ,  Syuhei Kurokawa
Publisher:   William Andrew Publishing
Imprint:   William Andrew Publishing
Dimensions:   Width: 15.20cm , Height: 1.80cm , Length: 22.90cm
Weight:   0.440kg
ISBN:  

9780128103562


ISBN 10:   0128103566
Pages:   328
Publication Date:   30 October 2017
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Available To Order   Availability explained
We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately.

Table of Contents

Chapter 1: Introduction Chapter 2: Device fabrication with a silicon crystal substrate Chapter 3: Ultra-precision technology - taking silicon single crystal as an example Chapter 4: Applications of ultra-precision CMP in device processes Chapter 5: The future of processing technology Chapter 6: Progress of the semiconductor and silicon industries Chapter 7: Summary

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