Advances in Chemical Mechanical Planarization (CMP)
Author:   Babu Suryadevara (Professor Emeritus, Department of Chemical and Biomolecular Engineering, Clarkson University, United States)
Publisher:   Elsevier Science & Technology
ISBN:  

9780081001653


Pages:   536
Publication Date:   19 January 2016
Replaced By:   9780128217917
Format:   Hardback
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Our Price $752.40 Quantity:  
Add to Cart

Share |

Advances in Chemical Mechanical Planarization (CMP)


Overview

Full Product Details

Author:   Babu Suryadevara (Professor Emeritus, Department of Chemical and Biomolecular Engineering, Clarkson University, United States)
Publisher:   Elsevier Science & Technology
Imprint:   Woodhead Publishing Ltd
Dimensions:   Width: 15.20cm , Height: 3.00cm , Length: 22.90cm
Weight:   0.690kg
ISBN:  

9780081001653


ISBN 10:   0081001657
Pages:   536
Publication Date:   19 January 2016
Audience:   Professional and scholarly ,  Professional & Vocational
Replaced By:   9780128217917
Format:   Hardback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Reviews

Author Information

Babu Suryadevara is distinguished professor and former director of the Center for Advanced Materials Processing (CAMP) at Clarkson University, United States. His research interests include CMP of metal and dielectric films, CMP for shallow-trench isolation, particle-free solutions for CMP, and post-CMP cleaning.

Tab Content 6

Author Website:  

Countries Available

All regions
Latest Reading Guide

NOV RG 20252

 

Shopping Cart
Your cart is empty
 Shopping cart
Mailing List

 

Sign up now