Free Delivery Over $100
|
|
|||
|
||||
OverviewAdvanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. Full Product DetailsAuthor: Guosheng Jiang , Liyong Diao , Ken KuangPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2013 ed. Dimensions: Width: 15.50cm , Height: 0.90cm , Length: 23.50cm Weight: 2.642kg ISBN: 9781489992543ISBN 10: 1489992545 Pages: 156 Publication Date: 15 October 2014 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsIntroduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
||||
