Advanced Thermal Management Materials
Author:   Guosheng Jiang ,  Liyong Diao ,  Ken Kuang
Publisher:   Springer-Verlag New York Inc.
Edition:   2013 ed.
ISBN:  

9781489992543


Pages:   156
Publication Date:   15 October 2014
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Advanced Thermal Management Materials


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Author:   Guosheng Jiang ,  Liyong Diao ,  Ken Kuang
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2013 ed.
Dimensions:   Width: 15.50cm , Height: 0.90cm , Length: 23.50cm
Weight:   2.642kg
ISBN:  

9781489992543


ISBN 10:   1489992545
Pages:   156
Publication Date:   15 October 2014
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.-  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.

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