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OverviewFull Product DetailsAuthor: Xingcun Colin Tong, Ph.D. (Laird Technologies, Schaumburg, Illinois, USA)Publisher: Taylor & Francis Inc Imprint: CRC Press Inc Dimensions: Width: 15.60cm , Height: 2.30cm , Length: 23.40cm Weight: 0.612kg ISBN: 9781420073584ISBN 10: 1420073583 Pages: 340 Publication Date: 19 November 2008 Audience: Professional and scholarly , Professional & Vocational , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print ![]() This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsElectromagnetic Interference Shielding Fundamentals and Design Guide. Characterization Methodology of EMI Shielding Materials. EMI Shielding Enclosure and Access. Metal-Formed EMI Gaskets and Connectors. Conductive Elastomer and Flexible Graphite Gaskets. Conductive Foam and Ventilation Structure. Board-Level Shielding Materials and Components. Composite Materials and Hybrid Structures for EMI Shielding. Absorber Materials. Grounding and Cable-Level Shielding Materials. Special Shielding Materials in Aerospace and Nuclear Industries. Perspectives and Future Trends. Index.ReviewsAuthor InformationLaird Technologies, Schaumburg, Illinois, USA Tab Content 6Author Website:Countries AvailableAll regions |