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Author:   Colin Tong
Publisher:   Springer International Publishing AG
Imprint:   Springer International Publishing AG
Edition:   1st ed. 2022
Volume:   327
Weight:   0.438kg
ISBN:  

9783031172090

ISBN 10:   3031172094
Pages:   261
Publication Date:   18 November 2023
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Chapter 1. 5G technology components and material solutions for hardware system integration.- Chapter 2. Semiconductor solutions for 5G.- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits.- Chapter 4. PCB materials and design requirements for 5G systems.- Chapter 5. Materials for high frequency filters.- Chapter 6. EMI shielding materials and absorbers for 5G communications.- Chapter 7. Thermal management materials and components for 5G devices.- Chapter 8. Protective packaging and sealing materials for 5G mobile devices.- Chapter 9. Perspectives on 5G and beyond applications and related technologies.

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Author Information

Colin Tong is a materials expert with considerable professional experience in the past two decades. His research & development activities and industrial practices cover a broad range of different fields with a special focus on materials testing and characterization, component design and processing of advanced composite materials, metallurgy, thermal management of electronic packaging, electromagnetic interference shielding, integrated optical waveguides, functional metamaterials and metadevices, energy materials, as well as flexible and printed electronics. He holds a Ph.D. degree in Materials Science and Engineering, and a Master’s as well as a Bachelor’s degree in Materials and Mechanical Engineering. Dr. Tong has published six books, over 30 peer-reviewed papers, and he holds 9 patents. He is a senior member of IEEE (Institute of Electrical and Electronics Engineers). He received the Henry Marion Howe Medal from ASM International for his contribution to research and development on advanced aluminum composite materials in 1999.

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