Advanced Flip Chip Packaging
Author:   Ho-Ming Tong ,  Yi-Shao Lai ,  C.P. Wong
Publisher:   Springer-Verlag New York Inc.
Edition:   2012
ISBN:  

9781441957672


Pages:   560
Publication Date:   21 March 2013
Format:   Hardback
Availability:   Awaiting stock   Availability explained
The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you.

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Advanced Flip Chip Packaging


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Author:   Ho-Ming Tong ,  Yi-Shao Lai ,  C.P. Wong
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2012
Dimensions:   Width: 15.50cm , Height: 3.30cm , Length: 23.50cm
Weight:   1.092kg
ISBN:  

9781441957672


ISBN 10:   1441957677
Pages:   560
Publication Date:   21 March 2013
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Awaiting stock   Availability explained
The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you.

Table of Contents

Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.-  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

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