Overview

This second edition of this book provides, at a high level and in a tractable fashion, a description of how wireless communications are achieved in the latest smartphones. The author shows how smartphones communicate via three separate systems, namely 5G/5G-Advanced, Wi-Fi 6/7, and Bluetooth 5/6. The book explores how 5G/5G-Advanced allows mobile voice and high-speed data communication, how Wi-Fi 6/7 allows smartphone attachment to the Internet independent of 5G/5G-Advanced, and how Bluetooth 5/6 allows smartphone attachment to speakers, in-car entertainment systems, smart watches, etc. This text explains the key basic technologies employed and addresses how each system operates. In addition, a cursory overview is provided of smartphone GPS navigation and iPhone satellite messaging. This book is of interest to anyone with a rudimentary scientific understanding who desires to know more at an intuitive level, rather than at a rigorous one, how smartphones achieve wireless communications.

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9783031828294

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Dr. Douglas H. Morais received a Ph.D from University of Ottawa, Canada, an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. Additionally, he is a Graduate of the AEA/Stanford Executive Institute, Stanford University, California, a Life Senior member of the IEEE Communications Society, and a member of the IEEE Communications Society. After decades in the industry, he is currently a technical book author, short course lecturer, and inventor. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of “Fixed Broadband Wireless Communications,” Pearson Education, Inc., 2004, “5G and Beyond Wireless Transport Technologies,” Springer, 2021, “5G NR, Wi-Fi 6, and Bluetooth LE 5,” Springer, 2023, and “Key 5G/5G-Advanced Physical Layer Technologies, Third Edition” Springer, 2024. He has three US patents, including two on digital modulation and one on point-to-multipoint communication.

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