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OverviewThree-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Full Product DetailsAuthor: Chuan Seng Tan Kuan-Neng Chen Steven J Koester , Kuan-Neng Chen (National Chiao Tung University, Hsinchu, Taiwan) , Steven Koester , Chuan Seng Tan (Nanyang Technological University, Singapore)Publisher: Pan Stanford Publishing Imprint: Pan Stanford Publishing ISBN: 9781322631813ISBN 10: 1322631816 Pages: 376 Publication Date: 01 January 2011 Audience: General/trade , General Format: Electronic book text Publisher's Status: Active Availability: In stock  We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviews3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology. Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA Author InformationTab Content 6Author Website:Countries AvailableAll regions |
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