3-Dimensional Process Simulation
Author:   J. Lorenz
Publisher:   Springer Verlag GmbH
Edition:   Softcover reprint of the original 1st ed. 1995
ISBN:  

9783709174302


Pages:   196
Publication Date:   06 October 2011
Format:   Paperback
Availability:   In Print   Availability explained
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3-Dimensional Process Simulation


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Overview

Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field.

Full Product Details

Author:   J. Lorenz
Publisher:   Springer Verlag GmbH
Imprint:   Springer Verlag GmbH
Edition:   Softcover reprint of the original 1st ed. 1995
Dimensions:   Width: 17.00cm , Height: 1.10cm , Length: 24.40cm
Weight:   0.375kg
ISBN:  

9783709174302


ISBN 10:   3709174309
Pages:   196
Publication Date:   06 October 2011
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications.- A Three-Dimensional Process Simulation using Advanced SMART-P program.- 3-D Topography Simulation Using Surface Representation and Central Utilities.- Three Dimensional Simulation of Thermal Processes.- 3D Process Simulation at IEMN/ISEN.- 3D Simulation of Topography and Doping Processes at FhG.- 3D TCAD at TU Vienna.- Multi-Dimensional TCAD: The PROMPT/DESSIS Approach.- 3D Process Simulation Requirements And Tradeoffs From Industrial Perspective.- Author Index.

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