Flexible Electronics, Volume 1: Mechanical background, materials and manufacturing

Author:   Vinod Kumar Khanna (CSIR-Central Electronics Engineering Research Institute, India and CSIR-CEERI, India)
Publisher:   Institute of Physics Publishing
ISBN:  

9780750314619


Pages:   372
Publication Date:   18 July 2019
Format:   Hardback
Availability:   In Print   Availability explained
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Flexible Electronics, Volume 1: Mechanical background, materials and manufacturing


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Overview

Flexible electronics is an emerging field with the potential for huge industrial importance. Comprising of three volumes, this work offers a cohesive, coherent and comprehensive overview of the subject. Themes covered include mechanical theory, materials science aspects, fabrication technologies, devices and applications. Khanna provides a systematic, step-by-step treatment of each topic and utilizes clear and attractive illustrations throughout. The latest research and developments in this discipline are included, providing an excellent resource for graduate students, researchers and industry scientists. This volume covers the mechanical aspects of hard-film/soft-substrate structures and the impacts of stress and strain, including deformation and cycling of ductile films, and straining permeation barriers.

Full Product Details

Author:   Vinod Kumar Khanna (CSIR-Central Electronics Engineering Research Institute, India and CSIR-CEERI, India)
Publisher:   Institute of Physics Publishing
Imprint:   Institute of Physics Publishing
Dimensions:   Width: 17.80cm , Height: 2.20cm , Length: 25.40cm
Weight:   0.862kg
ISBN:  

9780750314619


ISBN 10:   0750314613
Pages:   372
Publication Date:   18 July 2019
Audience:   General/trade ,  Professional and scholarly ,  General ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

1.The Flexible Electronics Paradigm 2.Mechanical Bending of a Circuit 3.Stresses and Strains in the Hard-Film/Soft-Substrate Structure 4.Curvature and Overlay Alignment of the Hard-Film/Soft-Substrate Structure 5.Providing Stretchability by Controlled Buckling of Films 6.Bending Brittle Films 7.Deformation and Cycling of Ductile Films 8.Straining Permeation Barriers Part 2: Materials 9.Inorganic Materials 10.Organic Materials 11.Nanomaterials: CNTs, Nanowires, Graphene and 2-D Materials Part 3: Manufacturing Equipment and Machines 12.Printing Techniques 13.Vacuum Deposition 14.Silicon Microlectronics/MEMS Processes 15.Packaging

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Author Information

Vinod Kumar Khanna is an emeritus scientist at CSIR-Central Electronics Engineering Research Institute, India, and an emeritus professor at the Academy of Scientific and Innovative Research, India. Additionally, he is a retired chief scientist and head of the MEMS and Microsensors Group, CSIR-CEERI, Pilani.

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