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OverviewFlexible electronics is an emerging field with the potential for huge industrial importance. Comprising of three volumes, this work offers a cohesive, coherent and comprehensive overview of the subject. Themes covered include mechanical theory, materials science aspects, fabrication technologies, devices and applications. Khanna provides a systematic, step-by-step treatment of each topic and utilizes clear and attractive illustrations throughout. The latest research and developments in this discipline are included, providing an excellent resource for graduate students, researchers and industry scientists. This volume covers the mechanical aspects of hard-film/soft-substrate structures and the impacts of stress and strain, including deformation and cycling of ductile films, and straining permeation barriers. Full Product DetailsAuthor: Vinod Kumar Khanna (CSIR-Central Electronics Engineering Research Institute, India and CSIR-CEERI, India)Publisher: Institute of Physics Publishing Imprint: Institute of Physics Publishing Dimensions: Width: 17.80cm , Height: 2.20cm , Length: 25.40cm Weight: 0.862kg ISBN: 9780750314619ISBN 10: 0750314613 Pages: 372 Publication Date: 18 July 2019 Audience: General/trade , Professional and scholarly , General , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1.The Flexible Electronics Paradigm 2.Mechanical Bending of a Circuit 3.Stresses and Strains in the Hard-Film/Soft-Substrate Structure 4.Curvature and Overlay Alignment of the Hard-Film/Soft-Substrate Structure 5.Providing Stretchability by Controlled Buckling of Films 6.Bending Brittle Films 7.Deformation and Cycling of Ductile Films 8.Straining Permeation Barriers Part 2: Materials 9.Inorganic Materials 10.Organic Materials 11.Nanomaterials: CNTs, Nanowires, Graphene and 2-D Materials Part 3: Manufacturing Equipment and Machines 12.Printing Techniques 13.Vacuum Deposition 14.Silicon Microlectronics/MEMS Processes 15.PackagingReviewsAuthor InformationVinod Kumar Khanna is an emeritus scientist at CSIR-Central Electronics Engineering Research Institute, India, and an emeritus professor at the Academy of Scientific and Innovative Research, India. Additionally, he is a retired chief scientist and head of the MEMS and Microsensors Group, CSIR-CEERI, Pilani. Tab Content 6Author Website:Countries AvailableAll regions |